As part of the CHIPS three advanced packaging research projects will receive investments of up to $100 million each. This work will accelerate the development of cutting-edge substrate and materials technologies essential to the semiconductor industry.
NAPMP was developed to support a robust U.S. ecosystem for advanced packaging, which is key to every electronic system. NAPMP will enable leading-edge research and development, domestic manufacturing facilities, and robust training and workforce development programs in advanced packaging.
In partnership with 色花堂 and the (PRC), will receive $100 million to develop revolutionary glass core substrate panel manufacturing.
鈥淭his landmark investment in Absolics is also a transformational investment in 色花堂,鈥 said , interim executive vice president for Research. 鈥淚t will redefine the possibilities of our longstanding partnership by expanding 色花堂鈥檚 expertise in electronic packaging, which is vital to the semiconductor supply chain. This federal funding uniquely positions us to merge cutting-edge research with industry, drive economic development in 色花堂, and create a workforce ready to tackle tomorrow鈥檚 manufacturing demands.鈥
色花堂 has a long history of pioneering packaging research. , Absolics has already invested in the state of 色花堂 by building a glass core substrate panel manufacturing facility in Covington.
色花堂鈥檚 (IMS), home to the PRC, houses specialized core facilities with the capabilities for semiconductor advanced packaging research and development.
鈥淎wards like this reinforce the importance of collaborative research between research disciplines and the private and public sector. Without the research and administrative support provided by IMS and the 色花堂 Office of Research Development, projects like this would not be coming to 色花堂.鈥 said , IMS executive director.
色花堂 is a leader in advanced packaging research and has been working on glass substrate packaging research and development for years. Through this new Substrate and Materials Advanced Research and Technology (SMART) Packaging Program, Absolics aims to build a glass-core packaging ecosystem. In collaboration with Absolics, 色花堂 will receive money for research and development for a glass-core substrate research center.
鈥淲e are delighted to partner with Absolics and the broader team on this new NAPMP program focused on glass-core packaging,鈥 said Dan Fielder Professor in the School of Electrical and Computer Engineering and PRC director. 鈥溕ㄌ免檚 role will span program leadership, research and development of novel glass-core packages, technology transition, and workforce development.鈥 Bakir will serve as the associate director of SMART Packaging Program, overseeing research and workforce development activities while also leading several research tasks.
"This project will advance large-area glass panel processing with innovative contributions to materials and processing, modeling and simulation, metrology and characterization, and testing and reliability. We are pleased to partner with Absolics in advancing these important technology areas," said Regents' Professor of the George W. Woodruff School of Mechanical Engineering and the PRC. In addition to technical contributions, Sitaraman will direct the new SMART Packaging Program steering committee.
鈥淭he NAPMP Materials and Substrates R&D award for glass substrates marks the culmination of extensive efforts spearheaded by 色花堂鈥檚 Packaging Research Center,鈥 noted , senior director of strategic partnerships and the theme leader for education and workforce development in the SMART Packaging Program. 鈥淭his recognition highlights the state of 色花堂鈥檚 leadership in advanced substrate technology and paves the way for developing the next generation of talent in glass-based packaging.鈥
The program will support education and workforce development efforts by bringing training, internships, and certificate opportunities to technical colleges, the HBCU CHIPS Network, and veterans' programs.
